Part Number : IMS1600S-70M
Manufacturer : Sgs Thomson Microelectronics Inc
NSN : 5962-01-283-4329 (5962012834329)
Alternate P/N : IMS1600S70M
INC Code : 41015
NCB Code : 01
FSG : 59 Electrical and Electronic Equipment Components
NIIN : 01-283-4329 (012834329)
Country : USA
Submit your RFQ below for Sgs Thomson Microelectronics Inc Part IMS1600S-70M, a high-quality Microcircuit Memory with NSN 5962012834329. Aviation Orbit provides a fast and reliable procurement solution for this part IMS1600S-70M, sourced directly from Sgs Thomson Microelectronics Inc (CAGE Code: 60911). The NSN 5962012834329 classifies this item under FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic, ensuring compliance with military and aviation standards.
For further identification, the NIIN 01-283-4329 confirms an NCB of 01 (origin: USA), while the INC 41015 provides additional classification details. Aviation Orbit streamlines the purchasing process, offering competitive pricing and dependable sourcing for Sgs Thomson Microelectronics Inc components. Submit your RFQ today for a quick response and seamless procurement experience.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-283-4329 Item Description: Microcircuit Memory | 5962 | 012834329 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Ims1600s-70m | 1 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.260 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES NOMINAL OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
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