Part Number : WS57C64F-70D
Manufacturer : Waferscale Integration Inc
NSN : 5962-01-319-0513 (5962013190513)
Alternate P/N : WS57C64F70D
INC Code : 41015
NCB Code : 01
FSG : 59 Electrical and Electronic Equipment Components
NIIN : 01-319-0513 (013190513)
Country : USA
Submit your RFQ below for Waferscale Integration Inc Part WS57C64F-70D, a high-quality Microcircuit Memory with NSN 5962013190513. Aviation Orbit provides a fast and reliable procurement solution for this part WS57C64F-70D, sourced directly from Waferscale Integration Inc (CAGE Code: 66579). The NSN 5962013190513 classifies this item under FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic, ensuring compliance with military and aviation standards.
For further identification, the NIIN 01-319-0513 confirms an NCB of 01 (origin: USA), while the INC 41015 provides additional classification details. Aviation Orbit streamlines the purchasing process, offering competitive pricing and dependable sourcing for Waferscale Integration Inc components. Submit your RFQ today for a quick response and seamless procurement experience.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-319-0513 Item Description: Microcircuit Memory | 5962 | 013190513 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Ws57c64f-70d | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 1.280 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.355 INCHES NOMINAL |
| ABMK | OVERALL WIDTH | 0.620 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.550 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | +0.0 TO 70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN AND ERASABLE AND HIGH PERFORMANCE AND HIGH SPEED AND LOW POWER AND PROGRAMMABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
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