Part Number : WS57C291B-45TMB
Manufacturer : Waferscale Integration Inc
NSN : 5962-01-354-4135 (5962013544135)
Alternate P/N : WS57C291B45TMB
INC Code : 41015
NCB Code : 01
FSG : 59 Electrical and Electronic Equipment Components
NIIN : 01-354-4135 (013544135)
Country : USA
Submit your RFQ below for Waferscale Integration Inc Part WS57C291B-45TMB, a high-quality Microcircuit Memory with NSN 5962013544135. Aviation Orbit provides a fast and reliable procurement solution for this part WS57C291B-45TMB, sourced directly from Waferscale Integration Inc (CAGE Code: 66579). The NSN 5962013544135 classifies this item under FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic, ensuring compliance with military and aviation standards.
For further identification, the NIIN 01-354-4135 confirms an NCB of 01 (origin: USA), while the INC 41015 provides additional classification details. Aviation Orbit streamlines the purchasing process, offering competitive pricing and dependable sourcing for Waferscale Integration Inc components. Submit your RFQ today for a quick response and seamless procurement experience.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-354-4135 Item Description: Microcircuit Memory | 5962 | 013544135 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Ws57c291b-45tmb | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 550.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 150.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.6 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| CZER | MEMORY DEVICE TYPE | EPROM |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS |
| FEAT | SPECIAL FEATURES | 2K X 8UV ERASABLE PROM |
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